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Heraeus licensed for the patents related to Nippon Micrometal
Pressemeldung von: - 17.04.2012 11:00 Uhr
Den verantwortlichen Pressekontakt, für den Inhalt der Pressemeldung, finden Sie unter der Pressemeldung bei Pressekontakt.
| The Heraeus business group Heraeus Materials Technology announces that it has been licensed for Nippon Micrometal"s patents related to Palladium Coated Copper Technology. Nippon Micrometal, a subsidiary of Nippon Steel Materials, is the world-wide market leader for palladium coated copper wire.
The Semiconductor industry of late has been rapidly adopting Copper and / or Palladium Coated Copper bonding wires in place of the more traditional Gold wires due to the recent surge in the prices of Gold. The features of this Palladium Coated wire technology greatly reduces precious metal usage (in comparison to Gold bonding wires) thereby lowering Semiconductor IC packaging costs.
Through this license Heraeus, a world-wide market leader for bare copper wire Producs, is now positioned to supply Palladium coated bonding wires thereby offering the full range of wires required by the semiconductor packaging industry.
"We are excited to announce this agreement as it enhances our ability to gain a significant market position in the growing segment of Palladium Coated Copper Bonding Wires" stated Dr. Tobias Mueller and Klaus Dittmer, the joint Business Unit Managers of the Bonding Wires in the Contact Materials Division of Heraeus. They further went on to state that this license "augments our already strong current leadership position in bare Copper bonding wires and further illustrates our ongoing commitment to the Bonding Wire business".
Heraeus has introduced this technology to the market in the last year under the product name PdSoft and has qualified the supply from their factories in Germany, Singapore, Korea and China, thereby showing a strong commitment to this new wire-bonding technology. Additionally Heraeus markets its other copper products under the trade names of MaxSoft, MaxSoft LD and the recently introduced RelCu.
For additional information, please contact:
Jack Belani
Bonding Wires Business Unit
Heraeus Materials Singapore Pte. Ltd.
1798 Technology Dr.
95110 San Jose, CA
Phone: +1 (408) 392-8955
Fax: +1 (408) 392-8957
E-Mail: Jack.Belani@heraeus.com
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